Recent #Heterogeneous Integration news in the semiconductor industry

4 months ago

➀ Multi-die design and heterogeneous integration are crucial for semiconductor technology scaling.

➁ Synopsys offers a comprehensive suite of solutions for multi-die design challenges.

➂ Detailed insights into multi-die system architecture, verification, implementation, and testing are provided by Synopsys white papers.

Design ImplementationDevice HealthEDAHeterogeneous IntegrationManufacturingMulti-die DesignSEMICONDUCTORSilicon IP IntegrationSynopsysSystem Verification
5 months ago
➀ The Fraunhofer IAF is enhancing its technology capabilities in III-V compound semiconductors for the APECS pilot line, contributing to the EU Chips Act.➁ The project is receiving €4.35 million from Baden-Württemberg's Ministry of Economic Affairs.➂ APECS aims to expand European R&D infrastructure and enhance semiconductor competitiveness.
ChipletFraunhofer IAFHeterogeneous IntegrationResearch and Developmentsemiconductor
6 months ago
➀ The APECS pilot line marks a significant step in strengthening Europe's semiconductor manufacturing and chiplet innovation. ➁ It aims to enhance technological resilience, cross-border collaboration, and global competitiveness. ➂ The line will provide advanced technology access to industry players, SMEs, and startups, establishing a strong foundation for European semiconductor supply chains. ➃ APECS focuses on bridging research with innovative developments in heterogeneous integration and advanced packaging.
Advanced PackagingChipletCollaborationEuropeFraunhoferHeterogeneous IntegrationMicroelectronicsinnovationresearchsemiconductor
6 months ago
➀ The APECS pilot line, a key part of the EU Chips Act, is launched to advance chiplet innovations and enhance European semiconductor manufacturing capabilities. ➁ The pilot line will provide low-barrier access to cutting-edge technologies for large companies, SMEs, and startups, ensuring secure and resilient semiconductor value chains. ➂ The APECS project is co-financed by the Chips Joint Undertaking and national funds from Belgium, Germany, Finland, France, Greece, Austria, Portugal, and Spain, with a total funding of 730 million euros over 4.5 years.
Advanced PackagingChipletEuropeGermanyHeterogeneous IntegrationMicroelectronicsinnovationsemiconductor
8 months ago
➀ Jiu Feng Mountain Laboratory achieves a breakthrough in the field of silicon photonics integration by successfully lighting up a laser source integrated into a silicon-based chip, the first of its kind in China. This achievement uses a self-developed heterogeneous integration technology and completes the process of phosphorus indium laser diode integration within an 8-inch SOI wafer. This technology, known as 'chip light output,' replaces electrical signals with better-performing optical signals for transmission, which is a crucial means to revolutionize inter-chip signal data transmission. It aims to solve the issue of electrical signals approaching their physical limits. This breakthrough will have a revolutionary impact on data centers, computing centers, CPU/GPU chips, AI chips, and other fields. ➁ The technology is considered an ideal solution for breaking through the bottlenecks of power consumption, bandwidth, and delay in the post-Moore era. The key challenge lies in the development and integration of silicon-based chip-on-chip light sources. This technology is one of the few blank spots in China's optoelectronics field. ➂ The technology can effectively solve the problems of insufficient coupling efficiency, long alignment adjustment time, and insufficient alignment accuracy in traditional silicon photonics chips, breaking through the production bottleneck of high cost, large size, and difficulty in large-scale integration.
Heterogeneous IntegrationSilicon Photonics